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Latest Product and Company News from Dynex

Custom Power Semiconductor Devices Tailored to Your Application

Vast in-house experience in the design, development and manufacture

Custom Power Semiconductor Devices Tailored to your Application

Applications for power electronics devices often involve harsh operating conditions or environments necessitating devices capable of meeting these requirements. Dynex utilise the vast in-house experience in the design, development and manufacture of high-reliability IGBT modules, bipolar devices and power assemblies to customise products to meet the individual demands for end applications, including those in the electric vehicle, power grid, renewable energy, traction, hydrogen electrolysis and industrial markets

Dynex products can be designed to standard industry format or end customer defined formats with bespoke connectivity and/or circuit topology and/or heatsinks water-cooled/air-cooled/phase change or double side. To ensure consistency of product performance and quality, manufacturing is carried out under strictly controlled clean room conditions.

From initial concept and design to production, Dynex support customer requirements to provide enhanced, reliable device outlines to meet your specific demands. Dynex modules and devices can be customised to benefit end-user applications in the following capacity:

  • Reduce system costs
  • Reduce total system size and weight
  • Improve thermal characteristics
  • Maximise system efficiency
  • Operate in severe environment

Custom IGBT Modules

Enhancing our range of power semiconductor devices, Dynex has the capability to design, develop and manufacture custom IGBT modules. High reliability IGBT modules can be customised to meet the individual demands for end applications including those in renewable energy and traction markets.

Dynex capabilities can encompass the following: 

  • Laser welded assemblies
  • Ultrasonic welding processes
  • Copper wire bonds
  • Various Die technologies (Trench gate, SiC) 
  • Liquid cooled heatsinks
  • Customised busbar arrangements
  • Silver sintering
  • Customised packaging (case materials)
  • Hermetic sealed packages

Using our in-house design team, Dynex continue to develop processes and designs to utilise the latest techniques to improve cooling, current output, lifetime and reliability.

Through initial concept to full production, Dynex will support your application requirements to provide enhanced, reliable device outlines to meet your specific demands.

For more information on how Dynex can help with your custom power semiconductor device needs, please email powersolutions@dynexsemi.com