The ever-changing landscape of power electronics market is increasing the need for efficient, reliable and power-dense systems across all industries. Dynex has responded to this with the recent launch of our first Generation 7 IGBT module, further extending the portfolio of IGBT's we develop and produce. The chip size of the new 7th Generation is smaller versus previous generation IGBT modules. This allows for a higher current density.
A thorough understanding of the operating conditions of the end application is the key to developing highly targeted IGBT specifications. At Dynex, system level optimisation is central to the IGBT design process.
Dynex DIM900M1HS12-PG500 and DIM800M1HS17-PG500 are able to operate at higher junction temperatures. The maximum junction temperature is 1750C with continuous operation up to T = 1500C.
The MI trench gate IGBT is optimised for solar power inverters, motor drives, power charging equipment and electric vehicle applications requiring high thermal cycling capability. The module incorporates an electrically isolated base plate and low inductance construction enabling designers to optimise circuit layouts and utilise grounded heat sinks for safety.
The Field Stop structure ensures a significant reduction in tail current that occurs during high speed switching.
Key Features:
- Ultrafine 7th generation STMOS trench gate IGBT chip technology
- High thermal cycling capabiliy
- CuBase with enhanced Si3N4 substrates
- 10µs short circuit withstand
- Low EON EOFF variant
- Compact module
- Built-in NTC thermistor
- Low thermal resistance
- Excellent switching performance
Applications:
- Motor drives
- Renewable energy
- Power charging equipment
- High reliability inverters
- Auxillary power supplies
Dynex IGBT chip technology extends from NPT for legacy products to the latest proprietary trench gate IGBT with improved thermal performancece, lower losses and improved RBSOA robustness.
Tool to assist system designers
To assist system designers, Dynex provide the use of our online design tool with module selection and power loss simulations. This unique tool offers a quick and a simple way for system designers to try various modules under popular circuit topologies, to identify the optimum module and simulate losses in the modules under their system conditions. Within a matter of minutes, designers can generate output graphs and power loss profiles of the modules at various positions in the circuit. The design tool can be accessed at www.dynexsemi.com under the design support tab.