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Latest Product and Company News from Dynex

IGBT Module with smooth switching and low losses

New K-module IGBT outline

Dynex are a vertically integrated facility with device design, wafer fabrication, packaging, qualification and testing available on site. Our R&D centre has dedicated engineers for design and simulation using the latest software packages.

All of our extensive range of IGBT modules can be fully customised to meet application specific requirements with alternative devices, materials, and interconnect technology. In fact, our IGBT modules can be customised to be as individual as you! We will even Design – Develop – and Deliver modules in your chosen colour.

IGBT modules are used in a variety of power electronics systems such as rail propulsion drives and auxiliaries, refurbishment applications, industrial motor drives and power supplies, renewable and power grid applications.

To complement our existing range of IGBT devices, we are excited to announce the launch of the DIM250KHM33-TS001 half bridge 3300V module. This K-package outline is a soft punch through n-channel enhancement mode. The IGBT has a wide reverse bias safe operating area (RBSOA) and is optimised for traction drives and other applications requiring high thermal cycling capability. The module incorporates an electrically isolated base plate and low inductance construction enabling circuit designers to optimise circuit layouts and utilise grounded heat sinks for safety.

Still in production is the DIM200KHM45-TS001, which will be available later this year.

Key Features of DIM250KHM33-TS001

➢ 10.2kV isolation

➢ 140mm x 73mm footprint

➢ Half bridge configuration

➢ 10µs Short Circuit Withstand

➢ High Thermal Cycling Capability

➢ High Current Density Enhanced DMOS SPT

➢ Isolated AlSiC base-plate for high power cycling capability with AlN substrates for low thermal resistance.

➢ Lead Free Construction

K- outline IGBT module applications include:

  • High reliability inverters
  • Motor controllers
  • Traction auxiliaries
  • Choppers

Dynex design, develop and produce high-power semiconductors while maintaining competitive lead times of 8 to 12 weeks on all standard IGBT modules.

IGBT modules are designed to produce high reliability and are customised to meet the individual demands for end applications including automotive, medical, renewable energy, traction and Industrial markets.

Contact Dynex on +44 (0)1522 500500 or powersolutions@dynexsemi.com for technical information on our newly launched K-module outline.